Packaging Module Development Engineer

Intel · US, Arizona, Phoenix

Pay

$134k–189k

Setting

On-site

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Skip to main content Welcome! Intel Corporation uses cookies and similar technologies on this website to improve your online experience, to analyze site usage and to show tailored advertising to you. For more information, visit our Cookie Notice. Decline Accept Cookies Intel Careers Sign In Life at Intel Search for Jobs Join Our Talent Community Packaging Module Development Engineer page is loaded Packaging Module Development Engineer Apply locations US, Arizona, Phoenix time type Full time posted on Posted 10 Days Ago time left to apply End Date: November 6, 2026 (30+ days left to apply) job requisition id JR0286214 Job Details: Job Description: The Advanced Packaging Technology and Manufacturing (APTM) organization is seeking a Metrology Equipment Engineer to drive process control, manufacturing data analytics, and yield improvement for Thermal Compression Bonding (TCB) technologies. The successful candidate develops and sustains metrology systems, measurement methods, and inspection equipment to support Intel’s roadmap for advanced packaging and Thermal Compression Bonding technologies. They apply engineering principles and novel concepts to deliver measurement solutions that improve process control, product quality, reliability, productivity, yield, and manufacturability. Key Responsibilities Optimizes metrology capability across laboratory and manufacturing environments by developing and qualifying measurement processes, equipment specifications, calibration methods, and correlation techniques. Uses design of experiments, statistical analysis, and measurement system analysis to improve repeatability, reproducibility, and consistency across tools, sites, and product generations. Documents technical findings and improvements through white papers, reports, and qualification summaries. Establishes measurement specifications and collaborates with equipment suppliers, internal development teams, quality, process, and manufacturing organizations to ensure measurement capability, traceability, and data integrity meet program needs. Provides technical consultation on measurement challenges, equipment issues, lab-to-factory correlation, and metrology process improvements. Supports standardization of metrology methods, and works closely with packaging technology development, process engineering, and partner engineering groups to assess readiness and meet product milestones. Qualifications: You must possess the minimum education requirements and minimum required qualifications to be initially considered for this position. Additional preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Minimum Qualifications Bachelor's degree with 4+ years or Master's degree with 3+ years, or PhD with 1+ years of relevant experience in Electrical Engineering, Mechanical Engineering, Physics, Metrology, Instrumentation, Optical Engineering, or a related engineering discipline. 1+ years of Hands-on experience in metrology systems development, measurement equipment qualification, calibration, and/or measurement method development in a manufacturing, lab, or engineering environment. 2+ years of knowledge of measurement system analysis (MSA), including bias, linearity, stability, repeatability, and reproducibility. 2+ years of experience with electrical measurements and test, such as continuity, resistance, leakage, signal integrity basics, or related parametric test methods. 2+ year of experience with optical metrology, including microscopes, imaging systems, inspection methods, and/or machine vision. 2+ years of working knowledge of data analysis tools such as Python, Excel, SQL, or similar tools for measurement analysis and reporting. Preferred Qualifications Experience in semiconductor manufacturing, preferably in advanced packaging. Experience developing or sustaining metrology systems for process control, product qualification, or reliability evaluation. Strong background in equipment selection, tool qualification, acceptance testing, and calibration traceability. Experience with machine vision systems, automated inspection, or camera-based measurement techniques. Familiarity with lab-to-factory correlation, tool matching, and cross-tool measurement agreement studies. Experience with DOE, correlation analysis, and method optimization for metrology or test systems. Knowledge of quality systems, measurement documentation, and standardization of metrology methods. Experience working with suppliers, vendors, or external calibration/measurement service providers. Demonstrated ability to analyze measurement data using statistical methods to identify variation, correlation issues, tool drift, and root causes. Join us at Intel to contribute to technological advancements while building a rewarding and impactful career. Apply now to be a part of our extraordinary journey. Job Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Arizona, Phoenix Additional Locations: Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Position of Trust N/A Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel. Annual Salary Range for jobs which could be performed in the US: $133,800.00-188,890.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process. Work Model for this Role This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change. * ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter. Similar Jobs (5) Packaging Module Development Engineer locations US, Arizona, Phoenix time type Full time posted on Posted 5 Days Ago Packaging Module Development Engineer locations US, Arizona, Phoenix time type Full time posted on Posted 30+ Days Ago Packaging Module Development Engineer locations US, Arizona, Phoenix time type Full time posted on Posted 4 Days Ago time left to apply End Date: November 13, 2026 (30+ days left to apply) View All 5 Jobs About Us Intel’s official careers website. Find your next job and take on projects that shape tomorrow’s technology. Discover your place in our world-changing work Benefits Internships Life at Intel Locations Recruitment Process Three recognitions. One Intel. 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